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2 Layer Rogers Sensor PCB Duroid Ro6006 DK6.15 0.635mm High Frequency

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2 Layer Rogers Sensor PCB Duroid Ro6006 DK6.15 0.635mm High Frequency

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Brand Name : XCE

Model Number : XCEr

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Surface finish : ENIG

Board THK : 0.635 mm

Product name : rogers 6006pcb

Size : 3*3 CM

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2 Layer Rogers Sensor PCB Duroid Ro6006 DK6.15 0.635mm High Frequency

Specification:

Brand: XCE
Model: XCEr
Board size: 3*3cm
Cu thickness: 35UM
Material: rogers
Min line space&width: 5Mil

Parameter:

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2

Description:

For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. In addition, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent.

Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate.

We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.

Nowadays, higher frequencies are applied to electronic circuits in a wide range of areas.

In order to meet the increasing demand for miniaturization and to utilize high frequency, higher-density PCBs are necessary.


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