Xinchenger Electronics In-House Rogers PCB Prototype Service
If you are in need of Rogers or RF PCB prototype services, Contact Xinchenger Electronics today. Our PCB design experts can deliver on your requirements for virtually any type of PCB prototype service use, from single Rogers,Taconic,F4B boards to double-sided Rogers,Taconic,F4B boards to high-technology blind and buried via boards, Xinchenger Electronics can provide your prototype quickly, efficiently and at a price you can afford.
Xinchenger Electronics is a leader in Rogers,Taconic,F4B and other RF PCB prototype service in China because of our attention to detail and commitment to quality. We fabricate a complete an accurate RF PCB prototype, creating a sample circuit board to your specifications, which your designers can then use to make changes and test the design before you begin the full manufacturing process. Failure to test and modify your design with an accurately fabricated PCB prototype could result in extremely costly errors down the road.
In simplest terms, an RF printed circuit board is working with what’s essentially a very high-frequency analog signal. Your RF signal can be almost any voltage and current level at any point in time, as long as it’s between your minimum and maximum limits.
RF and microwave printed circuit boards operate on a frequency and pass signals within a certain band. Band pass filters are used to transmit signals in the “band of interest,” and anything outside of this frequency range is filtered out. Bands can be narrow or wide and can be carried via high-frequency carrier waves.
RF printed circuit board suppliers and manufacturers require a mix of standard and specialty equipment for proper processing and manufacturing. Plasma etch machinery is one of the more significant requirements, because it can maintain high quality in the thru-holes with minimal deviance.
Laser direct imaging (LDI) equipment is also commonly used for RF circuits, because it serves better than traditional photo exposure tools. You’ll want an LDI backing to ensure that board manufacturing maintains an extremely tight trace width, as well as front-to-back registration requirements.
| PC BOARD TECHNOLOGIES |
STANDARD |
PROTOTYPE |
ADVANCED
(HDI) |
| |
|
|
|
| Up To 20 Layers |
Yes |
Yes |
Yes |
| Blind & Buried Vias |
Yes |
Yes |
Yes |
| Via In Pad |
Yes |
Yes |
Yes |
| Sequential Lamination |
Yes |
Yes |
Yes |
| Impedance Control |
Yes |
Yes |
Yes |
| Hybrids & Mixed Dielectrics |
Yes |
Yes |
Yes |
| Rigid |
Yes |
Yes |
Yes |
| Rogers&Taconic&Isola&F4B |
Yes |
Yes |
Yes |
| Conductive Hole Fill |
Yes |
Yes |
Yes |
| Edge Plating & Constellation |
Yes |
Yes |
Yes |
| Variety of Panel Sizes Available |
Yes |
Yes |
Yes |
| |
|
|
|
| DIMENSIONS |
|
|
|
| |
|
|
|
| Maximum Panel Sizes |
18” X 24”
(457mm X 609mm) |
18” X 24”
(457mm X 609mm) |
12’ X 18”
(305mm X 457mm) |
| Maximum Usable area |
16” X 22”
(406mm X 559mm) |
16” X 22”
(406mm X 559mm) |
10.4” X 16”
(264mm X 406mm) |
| Minimum Board Thickness |
0.030” (0.762mm) |
0.005” (0.127mm) |
0.005” (0.127mm) |
| Minimum Core Thickness |
0.014” (0.356mm) |
0.005” (0.127mm) |
0.003” (0.076mm) |
| Thickness Tolerance |
±10% |
±8% |
±7% |
| Dimensional Tolerance |
±10 mil |
±7 mil |
±5 mil |
| |
|
|
|
| COPPER PADS & TRACES |
|
|
|
| Min Trace Width & Spacing |
0.007”/0.007” (0.178mm/0.178mm) |
0.005”/0.005” (0.127mm/0.127mm) |
0.003”/0.003” (0.076mm/0.076mm) |
| Minimum SMD Spacing |
0.004” (0.102mm) |
0.004” (0.102mm) |
0.004” (0.102mm) |
| Minimum SMD Pitch |
0.008” (0.203mm) |
0.008” (0.203mm) |
0.008” (0.203mm) |
| Min Annular Ring – Via |
0.005” (0.127mm) |
0.004” (0.102mm) |
0.003” (0.076mm) |
| Min Annular Ring – Component |
0.007” (0.178mm) |
0.005” (0.127mm) |
0.003” (0.076mm) |
| Max Finish Cu Weight – Outer |
8 OZ |
20 OZ |
40 OZ |
| Max Finish Cu Weight – Inner/td> |
1 OZ |
4 OZ |
6 OZ |
| Minimum Pad Size For Testing |
0.010” (0.254mm) |
0.008” (0.203mm) |
0.006” (0.152mm) |
| |
|
|
|
| DRILLS |
|
|
|
| Smallest Drill Diameter |
0.012” (0.305mm) |
0.008″ (0.203mm) |
0.006″ (0.152mm) |
| Minimum Plated Hole Size |
0.008″ (0.203mm) |
0.006″ (0.152mm) |
0.006″ (0.152mm) |
| Minimum Unplated Hole Size |
0.008″ (0.203mm) |
0.006″ (0.152mm) |
0.006″ (0.152mm) |
| Tolerance of Plated Holes |
±0.003″ (±0.076mm) |
±0.002″ (±0.051mm) |
±0.002″ (±0.051mm) |
| Tolerance of Unplated Holes |
±0.002″ (±0.051mm) |
±0.002″ (±0.051mm) |
±0.001″ (±0.025mm) |
| Maximum PTH Aspect Ratio |
5:1 |
8:1 |
10:1 |
| |
|
|
|
| Blind And Buried Vias |
|
|
|
| Max Blind Via Aspect Ratio |
5:1 |
8:1 |
10:1 |
| Min Blind Via Hole Size |
0.008″ (0.203mm) |
0.008″ (0.203mm) |
0.008″ (0.203mm) |
| Min Buried Via Hole Size |
0.008″ (0.203mm) |
0.008″ (0.203mm) |
0.008″ (0.203mm) |
| |
|
|
|
| Via In Pad |
|
|
|
| Conductive Fill |
Yes |
Yes |
Yes |
| Non-Conductive Fill |
Yes |
Yes |
Yes |
| |
|
|
|
| SURFACE FINISHES |
|
|
|
| HASL |
Yes |
Yes |
Yes |
| ENIG |
Yes |
Yes |
Yes |
| ENENIG |
Yes |
Yes |
Yes |
| Immersion Silver |
Yes |
Yes |
Yes |
| Immersion Tin |
Yes |
Yes |
Yes |
| Lead Free HASL |
Yes |
Yes |
Yes |
| |
|
|
|
| SOLDER MASK AND LEGEND |
|
|
|
| Green, Red, Black, Yellow, Blue, White, Clear, Grey, Purple |
Yes |
Yes |
Yes |
| |
|
|
|
| FABRICATION |
|
|
|
| V-Score |
Yes |
Yes |
Yes |
| V-Score Angles |
30° |
30° |
30° |
| Bevel Angles |
15°, 30° and
45° |
15°, 30° and
45° |
15°, 30° and 45° |
| |
|
|
|
| QUALITY AND TESTING |
|
|
|
| Certifications |
|
|
|
| ISO 9001:2015 |
Yes |
Yes |
Yes |
| UL E103209 |
Yes |
Yes |
Yes |
| IPC 6012, Class 1, 2 And 3 |
1 and 2 |
1 and 2 |
1 and 2 |
| |
|
|
|
| Test And Measurement |
|
|
|
| ZMetrix TDR |
Yes |
Yes |
Yes |
| Camtek AOI |
Yes |
Yes |
Yes |
| CMI XRF |
Yes |
Yes |
Yes |
| MicroCraft, ATG FPT |
Yes |
Yes |
Yes |
| |
|
|
|
| Electrical Test Ranges |
|
|
|
| Continuity |
5-80 Volts |
5-80 Volts |
5-80 Volts |
| Isolation |
10M Ohm |
10M Ohm |
10M Ohm |
| Voltages |
100 Volts |
100 Volts |
100 Volts |
| Controlled Impedance |
±10% |
±8% |
±7% |
| |
|
|
|
| AVAILABLE REPORTS |
|
|
|
| |
|
|
|
| Microsection |
Yes |
Yes |
Yes |
| Solderability |
Yes |
Yes |
Yes |
| CTM via X-Ray Fluorescence |
Yes |
Yes |
Yes |
| Time Domain Reflectrometry |
Yes |
Yes |
Yes |
| COC & FIR |
Yes |
Yes |
Yes |
Product Tags:
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