High Frequency Rogers 3206 Pcb With Stable Permittivity In Faini Telecommunication System
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :12*4cm
5. Permittivity : 10.2
6. Surface finish : ENIG
Features:
RO3203™ , RO3206™ and RO3210™ high frequency circuit materials are ceramic- fi lled laminates reinforced with woven fi berglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3200™ series high frequency materials were designed as an extension of the RO3000® series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability.
The dielectric constant of RO3203 high frequency circuit materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz. The dielectric constant for RO3206 laminate is 6.15 and 10.2 for RO3210 laminate. The dissipation factor for RO3206 and RO3210 laminates is 0.0027.
Parameter:
| Model |
Parameter |
thickness(mm) |
Permittivity(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO5880 |
0.254 0.508 0.762 |
2.20 ± 0.02 |
| RO4350 |
0.254 0.508,0.8,1.524 |
3.5 |
| RO4003 |
0.508 |
3.38 |
| TACONIC |
TLF-35 |
0.8 |
3.5 |
| TLA-6 |
0.254,0.8,1,1.5, |
2.65 |
| TLX-8 |
0.254,0.8,1,1.6 |
2.55 |
| RF-60A |
0.64 |
6.15 |
| TLY-5 |
0.254,0.508,0.8 |
2.2 |
| TLC-32 |
0.8,1.5,3 |
3.2 |
| TLA-35 |
0.8 |
3.2 |
| ARLON |
AD255C06099C |
1.5 |
2.55 |
| MCG0300CG |
0.8 |
3.7 |
| AD0300C |
0.8 |
3 |
| AD255C03099C |
0.8 |
2.55 |
| AD255C04099C |
1 |
2.55 |
| DLC220 |
1 |
2.2 |
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Data :
| Layer |
1 to 28 layers |
| Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness |
0.21mm to 7.0mm |
| Copper thickness |
0.5 OZ to 7.0 OZ |
| Copper thickness in hole |
>25.0 um (>1mil) |
|
Size
|
Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) |
| Min. Line Width: 3mil (0.075mm) |
| Min. Line Spacing: 3mil (0.075mm) |
|
Surface finishing
|
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
|
Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
| Certificate |
UL, ISO 9001, ISO 14001 |
| Special requirements |
Buried and blind vias+controlled impedance +BGA |
| Profiling |
Punching, Routing, V-CUT, Beveling |
|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
|
Benefits:
- High frequency performance (RO3203™ laminate) can be used in applications exceeding 20 GHz
- Suitable for use with epoxy multi-layer board hybrid designs
- Surface smoothness allows for finer line etching tolerances
Typical Applications:
- Automotive collision avoidance systems
- Automotive global positions satellite antennas
- Wireless telecommunications systems
- Microstrip patch antennas for wireless communications
- Direct broadcast satellites
- Datalink on cable systems
- Remote meter readers
- Power backplanes
- LMDS and wireless broadband
- Base station infrastructure
Production Description :
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K),[1] 0.343 W/(m·K)[2] |
| Thermal conductivity, in-plane |
0.81 W/(m·K),[1] 1.059 W/(m·K)[2] |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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High Frequency Rogers 3206 Pcb With Stable Permittivity In Faini Telecommunication System Images
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