High Frequency Rogers 3206 Pcb With Stable Permittivity In Faini Telecommunication System
Quick Detail :
1. Type : Pcb
2. Material : Rogers
3. Layer : Multilayer
4. Products Size :12*5cm
5. Permittivity : 3.5
6. Surface finish : ENIG
Features:
RO3035™ high frequency circuit materials are ceramic- fi lled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3000® series laminates are ceramic-fi lled PTFE based circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multilayer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems.
Parameter:
| Model |
Parameter |
thickness(mm) |
Permittivity(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO5880 |
0.254 0.508 0.762 |
2.20 ± 0.02 |
| RO4350 |
0.254 0.508,0.8,1.524 |
3.5 |
| RO4003 |
0.508 |
3.38 |
| TACONIC |
TLF-35 |
0.8 |
3.5 |
| TLA-6 |
0.254,0.8,1,1.5, |
2.65 |
| TLX-8 |
0.254,0.8,1,1.6 |
2.55 |
| RF-60A |
0.64 |
6.15 |
| TLY-5 |
0.254,0.508,0.8 |
2.2 |
| TLC-32 |
0.8,1.5,3 |
3.2 |
| TLA-35 |
0.8 |
3.2 |
| ARLON |
AD255C06099C |
1.5 |
2.55 |
| MCG0300CG |
0.8 |
3.7 |
| AD0300C |
0.8 |
3 |
| AD255C03099C |
0.8 |
2.55 |
| AD255C04099C |
1 |
2.55 |
| DLC220 |
1 |
2.2 |
Description :
1.Professional manufacturer of PCB specialized in single-sided PCB, double-sided PCB, multilayer PCB.
2. Material Type: FR4,non-halogen material ,Aluminium Base,Cooper Base,high frequency material ,Thick copper foil,94-V0(HB),PI Material,HIGH TG:SL S1000-2,ITEQ:IT180
3. Surface treatment: HAL,Immersion Gold,Immersion Tin,Immersion silver,Gold Finger,OSP,HAL(Immersion Gold,OSP,Immersion silver,Immersion Tin)+Gold Finger
Data :
| Layer |
1 to 28 layers |
| Material type |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board thickness |
0.21mm to 7.0mm |
| Copper thickness |
0.5 OZ to 7.0 OZ |
| Copper thickness in hole |
>25.0 um (>1mil) |
|
Size
|
Max. Board Size: 23 × 25 (580mm×900mm) |
| Min. Drilled Hole Size: 3mil (0.075mm) |
| Min. Line Width: 3mil (0.075mm) |
| Min. Line Spacing: 3mil (0.075mm) |
|
Surface finishing
|
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
|
Tolerance
|
Shape tolerance: ±0.13 |
| Hole tolerance: PTH: ±0.076 NPTH: ±0.05 |
| Certificate |
UL, ISO 9001, ISO 14001 |
| Special requirements |
Buried and blind vias+controlled impedance +BGA |
| Profiling |
Punching, Routing, V-CUT, Beveling |
|
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
|
Benefits:
- Laminates can be used in applications up to 30-40GHz
- Reliable stripline and mulilayer boards constructions
- Ideal for multilayer board designs with a range of dielectric constants
- Suitable for use with epoxy glass multilayer board hybrid designs
- Ideal for applications sensitive to temperature change
- Lower operating termperature and increase reliability in power amplifier applications
Typical Applications:
- band pass filters
- microstrip patch antennas
- voltage controlled oscillators
Production Description :
| Parameter |
Value |
| Specific gravity/density |
1.850 g/cm3 (3,118 lb/cu yd) |
| Water absorption |
−0.125 in < 0.10% |
| Temperature index |
140 °C (284 °F) |
| Thermal conductivity, through-plane |
0.29 W/(m·K),[1] 0.343 W/(m·K)[2] |
| Thermal conductivity, in-plane |
0.81 W/(m·K),[1] 1.059 W/(m·K)[2] |
| Rockwell hardness |
110 M scale |
| Bond strength |
> 1,000 kg (2,200 lb) |
| Flexural strength (A; 0.125 in) - LW |
> 440 MPa (64,000 psi) |
| Flexural strength (A; 0.125 in) - CW |
> 345 MPa (50,000 psi) |
| Tensile strength (0.125 in) LW |
> 310 MPa (45,000 psi) |
| Izod impact strength - LW |
> 54 J/m (10 ft·lb/in) |
| Izod impact strength - CW |
> 44 J/m (8 ft·lb/in) |
| Compressive strength - flatwise |
> 415 MPa (60,200 psi) |
| Dielectric breakdown (A) |
> 50 kV |
| Dielectric breakdown (D48/50) |
> 50 kV |
| Dielectric strength |
20 MV/m |
| Relative permittivity (A) |
4.8 |
| Relative permittivity (D24/23) |
4.8 |
| Dissipation factor (A) |
0.017 |
| Dissipation factor (D24/23) |
0.018 |
| Dielectric constant permittivity |
4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz |
| Glass transition temperature |
Can vary, but is over 120 °C |
| Young's modulus - LW |
3.5×106 psi (24 GPa) |
| Young's modulus - CW |
3.0×106 psi (21 GPa) |
| Coefficient of thermal expansion - x-axis |
1.4×10−5 K−1 |
| Coefficient of thermal expansion - y-axis |
1.2×10−5 K−1 |
| Coefficient of thermal expansion - z-axis |
7.0×10−5 K−1 |
| Poisson's ratio - LW |
0.136 |
| Poisson's ratio - CW |
0.118 |
| LW sound speed |
3602 m/s |
| SW sound speed |
3369 m/s |
|
Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.
Product Tags:
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High TG 4 Layer Rogers Ro3035 Pcb With 0.508 mm Material Used In Microvawe And RF Images
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