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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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2 Layer High Frequency PCB fabrication With Immersion Tin Finished Surface

Shenzhen Xinchenger Electronic Co.,Ltd
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2 Layer High Frequency PCB fabrication With Immersion Tin Finished Surface

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Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : High frequency material

Layer : 2

Color : White

Min line space : 4mil

Min line width : 4mil

Copper thickness : 2OZ

Board size : 60*60mm

Panel : 1

Surface : Immersion Tin

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2 Layer High Frequency PCB fabrication With Immersion Tin Finished Surface

Typical Applications:

High Frequency BGA PCB Board Testing Electronic
Antenna Radio FM Rogers 3003 High Frequency PCB With Half Hole In 0.79mm Thickness

  • Space Saving Circuitry
  • Patch Antennas
  • Satellite Communications Systems
  • Power Amplifiers
  • Aircraft Collision Avoidance Systems
  • Ground Radar Warning Systems
  • Datalink on cable systems
  • Remote meter readers
  • Power backplanes
  • LMDS and wireless broadband
  • Base station infrastructure

Electronic equipment is the development trend of high-frequency, especially in the wireless network, the growing development of satellite communications, information products to high
Speed and high-frequency, and communications products to the capacity of large-speed wireless transmission of voice, video and data standardization.
Of the new generation products need high-frequency substrate, satellite systems, mobile phone base stations and other communications products must be used to receive high-frequency circuit
Board, in the next few years will inevitably rapid development of high-frequency substrate will be a lot of demand.

The basic characteristics of high-frequency substrate material requirements are the following:
(1) the dielectric constant (Dk) must be small and very stable, usually the smaller the better the signal transmission rate and the dielectric constant
Of the square root is inversely proportional to high dielectric constant likely to cause signal transmission delay.
(2) Dielectric loss (Df) must be small, which mainly affects the quality of signal transmission, the smaller the dielectric loss so that the signal loss is also smaller.
(3) and copper foil thermal expansion coefficient as far as possible, because inconsistencies in the change in the cold and heat caused by copper foil separation.
(4) low water absorption, high water absorption will be affected in the damp when the dielectric constant and dielectric loss.
(5) Other heat resistance, chemical resistance, impact strength, peel strength, etc. must also be good.
Advantage

2 Layer High Frequency PCB With Immersion Tin Finished Surface

Rogers 5880 pcb substrate superiority

1.Sufficient high frequency material raw
2. PCB Have the comprehensive quality control system
3. PCB good price
4. PCB quick turn delivery time from 48hours.
5. PCB certification(ISO/UL E354810/RoHS)
6. 12 years experience in exporting service
7. PCB is no MOQ/MOV.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling



Rogers material in stock:

Brand Model Thickness(mm) DK(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO4003 0.254 0.508,0.813,1.524 3.38
RO4350 0.254 0.508,0.762,1.524 3.5
RO5880 0.254.0.508.0.762 2.2
RO3003 0.127,0.508,0.762,1.524 3
RO3010 0.635 10.2
RO3206 0.635MM 10.2
R03035 0.508MM 3.5
RO6010 0.635MM, 1,27MM 10.2


Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .
What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Q:Are you Factory or Trade company?
A:We are factory manufacturer,welcome to visit our factory.
Q:What kind of PCB file format can you accept for production?
A:Gerber, PROTEL 99SE, PROTEL DXP, POWER PCB
Q:Can you accept copy board?
A:Yes,if you have pcb sample,can send to us,not only for PCB board,but also for PCBA,we can accept copy board
Q:How about your factory production capacity?
A:FR4:2000000Sqms High Frequency board:10000Sqms


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